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 NCP1212 Current Mode PWM Controller for Both Forward and Flyback Converters
NCP1212 is a high performance current mode PWM controller specifically designed for off-line and DC-to-DC converter applications. The device requires very few external components and offers designer additional protection for better system reliability. The device features a trimmed oscillator for precise Duty Cycle control, accurate bandgap voltage reference, high gain error amplifier, current sensing comparator and a high current totem pole output gate driver that ideally drives the external power MOSFET. Additionally, the device has built-in programmable Brownout Detect and Soft-Start features to enhance system reliability. Also, the 48%/82% selectable maximum turn on Duty Cycle control and external programmable switching frequency capabilities make this device an ideal controller for both forward and flyback configurations. This device is available in both PDIP-8 and space saving SOIC-8 packages.
Features http://onsemi.com MARKING DIAGRAM
8 8 1 SOIC-8 DSUFFIX CASE 751 1 N1212 ALYW G
8 PDIP-8 N SUFFIX CASE 626 1 1 NCP1212 AWL YYWWG
* Trimmed Oscillator Charge and Discharge Current for Precise Duty * * * * * * * * * * * * * * * * * * *
Cycle Control Internal High Accuracy Bandgap Voltage Reference Current Mode Operation up to 200 kHz Inherent Feed Forward Compensation Latching PWM for Cycle-by-Cycle Current Limiting High Current Totem Pole Output Gate Driver Low Startup and Operating Current Internal Undervoltage Lockout with Hysteresis Internal Leading Edge Blanking for Current Feedback Direct Interface with Optocoupler for Secondary Sensing Built-in Soft-Start Function, Programmable by External Capacitor User Programmable 48%/82% Maximum Duty Cycle Selection Output Overvoltage Protection Against Open Loop AC Line Brownout Detect Protection Output Overload Protection Irrespective of Auxiliary Voltage Level Pb-Free Packages are Available
8
A L, WL Y, YY W, WW G G
= Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package = Pb-Free Package
PIN CONNECTIONS
FB BOK CS CT 1 2 3 4 (Top View) 8 7 6 5 SS/DMAX VCC DRV GND
ORDERING INFORMATION
Device NCP1212DR2 NCP1212DR2G NCP1212P NCP1212PG Package SOIC-8 SOIC-8 (Pb-Free) PDIP-8 PDIP-8 (Pb-Free) Shipping 2500/Tape & Reel 2500/Tape & Reel 50 Units / Rail 50 Units / Rail
Typical Applications
ATX PC Power Supply Universal Input Wall Mount Adaptors CRT Monitor All Flyback and Forward SMPS Systems
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2005
1
September, 2005 - Rev. 3
Publication Order Number: NCP1212/D
F1 FUSE T3 C2 10 nf/1 kv 1 D2 MBR3045 R1 576 K 3 + 2 C1 470 mf/400 V R2 3.3 K Rsense 0.22/2 W Q1 R3 36 K D1 MUR180
RFI FILTER BR1 3 4
5V
2
AC Input + - X2 Cap 1
X2 Cap
+ C7 3300 mf/ 10 V
0
GND Form Standby SMPS Auxiliary Winding IC1 NCP1212 FB BOK CS CT C4 1 nf GND DRV C3 0.1 mf C5 0.1 mf 4 VCC SS/DMAX
NCP1212
Figure 1. Typical Application Circuit
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2
R6 220
PC817 1 2 IC2 3 U1 TL431 C6 R5 100 0.1 mf R8 300
+5 V 9K
-
+5 V SS/DMAX 8 mA 3R 28 mA
- +
- + + 0.5 V - OVLO (25 V) UVLO (10 V) Overload Shutdown
+
FB R - +
VCC
CS Current Limit - + +
+ -
300 ns LEB 5V +5 V 45 mA 1V -
Vref Regulator - + + 15 V -
NCP1212
+ - CLK 1.21 V D
CLK
Figure 2. Simplified Functional Block Diagram
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SW2 - + S Q D Q Brownout Detection OSC Clock + - IMAX Max. Duty Cycle 48% or 82% + 3.2 V - - + Q S Q Reset Overload Enable
3
BOK
F/F R Q Totem Pole Drive S Q DRV
CT
GND
NCP1212
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PIN FUNCTION DESCRIPTION
Pin 1 2 Name FB Function Description Feedback Input This pin detects voltage feedback from output, can be connected directly to the optocoupler collector pin. BOK Brownout Detect with Hysteresis This is the inverting input of the brownout detect comparator. The brownout detect comparator has a detect threshold voltage of 1.21 V. This pin senses the voltage of the bulk capacitor through a resistor divider network to determine the brownout event. The hysteresis band is provided by a 45 mA current flows out of this pin to the resistor network. During output on-time of the power switch, this pin receives a voltage proportional to power switch current set by the current sensing resistor. The information is utilized to terminate output switch conduction by PWM action or overcurrent limit circuitry. Connecting a capacitor from CT pin to ground programs the internal oscillator frequency. The oscillator can operate up to 200 kHz. - This is a high current totem pole output. The PWM driving control is provided by this pin. The current and slew rate capability of this pin are suitable to drive a Power MOSFET. This pin is the positive supply of the IC. The driver output gets disabled when the voltage becomes higher than 25 V and the operating range is between 10 V and 25 V. The startup voltage is set at 15 V. This is a multi-function pin. Soft-start effect is provided during startup with a capacitor connected to this pin. After soft-start period elapsed, the capacitor is used for timing control to determine output overload. If only a capacitor is connected to this pin, its final voltage is X4.3 V and maximum turn-on duty cycle DMAX is set at 82%. Connect a resistor in parallel with the capacitor can alter the final voltage of this pin. 48% DMAX is selected if this pin stays at 2.1 V to 2.8 V after soft-start period. 3 CS Current Sense Input 4 5 6 7 CT GND DRV VCC Programmed Oscillator Frequency IC Ground Gate Driver Output Positive Supply to IC 8 SS/DMAX Soft-Start Time Programming and Maximum Duty Cycle Selection
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MAXIMUM RATINGS (TJ = 25C unless otherwise noted.)
Rating Power Supply Voltage (Pin 7) Symbol VCC VIO Value Unit V V V -0.3, 28 Input/Output Pins (Pins 1, 2, 3, 4, 8) Gate Driver Output Pin (Pin 6) -0.3, 6.5 -0.3, 14 100 178 IDRV TJ TA Tstg - - 1.0 -40 to +150 -25 to +105 -55 to +150 2.0 200 A C C C kV V VDRV Power Dissipation and Thermal Characteristics Thermal Resistance, Junction-to-Air, PDIP-8 Version Thermal Resistance, Junction-to-Air, SOIC-8 Version Output Current, Source or Sink Operating Junction Temperature Range Operating Ambient Temperature Range Storage Temperature Range ESD Capability, HBM (All pins except VCC pin) (Note 1) ESD Capability, Machine Model (All pins except VCC pin) (Note 1) RqJ-A C/W Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model (HBM) v2.0 kV per JEDEC standard: JESD22-A114. Machine Model (MM) v200 V per JEDEC standard: JESD22-A115. 2. Latchup Current Maximum Rating: "150 mA per JEDEC standard: JESD78.
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NCP1212
ELECTRICAL CHARACTERISTICS (For typical values TJ = 25C, DMAX = 48%, for min/max values TJ = -25C to +105C,
VCC = 16 V unless otherwise noted.) Characteristic OSCILLATOR SECTION Oscillation Frequency, TJ = 25C (DMAX = 48%, CT = 1.0 nF) Oscillation Frequency, TJ = 25C (DMAX = 82%, CT = 1.0 nF) Frequency Change against Supply Voltage (VCC = 13 V to 25 V, TJ = 25C) Frequency Change against Temperature (VCC = 16 V, TJ = -25C to 105C) CURRENT SENSE SECTION Maximum Current Sense Input Threshold Propagation Delay (Current Sense to Gate after LEB Blanking) Leading Edge Blanking Time SOFT-START SECTION Soft-Start Charge Current Overload Timing Discharge Current (Note 3) 48% Duty Cycle Selection Input Voltage Threshold 82% Duty Cycle Selection Input Voltage Threshold GATE DRIVER SECTION Gate Drive Sink Capability, VCC = 15 V, VDRV = 1.0 V Gate Drive Source Capability, VCC = 15 V, VDRV = 5.0 V (Note 4) Gate Drive Voltage (From 1.0 V to 11 V) Rise Time (CL = 1.0 nF, TJ = 25C) Gate Drive Voltage (From 11 V to 1.0 V) Fall Time (CL = 1.0 nF, TJ = 25C) IC POWER SUPPLY SECTION VCC Startup Threshold Voltage VCC Overvoltage Lockout Threshold VCC Undervoltage Lockout Threshold Power Supply Current, before Startup (VCC = 12 V) Power Supply Current, Operating Power Supply Current, Shutdown (VCC = 15 V) BROWNOUT DETECT SECTION (BOK) Brownout Input Threshold Voltage Brownout Hysteresis Current MAXIMUM DUTY CYCLE SECTION Maximum Duty Cycle at Soft-Start Pin Voltage between 2.1 V and 2.8 V (2.1 V v VDMAX v 2.8 V) Maximum Duty Cycle at Soft-Start Pin Voltage Higher than 3.0 V (VDMAX w 3.0 V) 3. ISD is an internal current source not accessible externally. 4. The output voltage is internally clamped by 13.5 V Zener. DMAX48 DMAX82 47 79 48 82 50 88 % % VBOK IBOK 1.14 38 1.21 45 1.27 54 V mA VCCTH VCCOVLO VCCUVLO IC1 IC2 IC3 13.5 22.5 8.5 - - - 15 25 10 0.15 3.0 3.0 16.5 27.5 11.5 0.26 5.0 - V V V mA mA mA IOL IOH Tr Tf - - - - 100 300 25 25 - - 50 50 mA mA ns ns ISS ISD-ISS VD48 VD82 5.0 15 - - 8.0 20 2.5 3.0 11 26 - - mA mA V V VCS TPLH TLEB 0.96 - - 1.0 150 300 1.16 200 - V ns ns FOSC-48 FOSC-82 DFOSC-V DFOSC-T 81 72 - - 90 80 0.02 5.0 99 88 - - kHz kHz % % Symbol Min Typ Max Unit
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NCP1212
TYPICAL CHARACTERISTICS
FOSC-82, OSCILLATOR FREQUENCY (kHz) FOSC-48, OSCILLATOR FREQUENCY (kHz) 95 100
90
90
80
85
70
80 DMAX = 48% CT = 1 nF 75 -25 1 27 53 79 105
60 DMAX = 82% CT = 1 nF 50 -25 1 27 53 79 105
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 3. Oscillator Frequency with 48% Duty Cycle vs. Junction Temperature
DFOSC-V, FREQUENCY CHANGE (%) 0.12 VCC = 13V to 25V 0.1 0.08 0.06 0.04 0.02 0 -25 VCS, MAXIMUM CURRENT SENSE INPUT THRESHOLD (V) 1.2
Figure 4. Oscillator Frequency with 82% Duty Cycle vs. Junction Temperature
1.15 1.1
1.05 1.0
0.95 0.9 -25
1
27
53
79
105
1
27
53
79
105
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 5. Frequency Change against Supply Voltage vs. Junction Temperature
TLEB, LEADING EDGE BLANKING TIME (ns)
Figure 6. Maximum Current Sense Input Threshold Voltage vs. Junction Temperature
200 TPLH, PROPAGATION DELAY (ns)
400 350 300 250 200 150 100 -25
160
120
80
40
0 -25
1
27
53
79
105
1
27
53
79
105
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 7. Propagation Delay vs. Junction Temperature http://onsemi.com
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Figure 8. Leading Edge Blanking Time vs. Junction Temperature
NCP1212
ISD-ISS, OVERLOAD TIMING DISCHARGE CURRENT (mA) 9 ISS, SOFT-START CHARGE CURRENT (mA) 8.5 8 35 30 25 20 15 10 5 0 -25 1 27 53 79 105
7.5 7
6.5 6 -25
1
27
53
79
105
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 9. Soft-Start Charge Current vs. Junction Temperature
VS2, 82% DUTY CYCLE SELECTION INPUT VOLTAGE THRESHOLD (V) 5 1.2
Figure 10. Overload Timing Discharge Current vs. Junction Temperature
4
ROL, OUTPUT SINK RESISTANCE (W)
1.1 VDRV = 1V 1
3
2
0.9
1
0.8
0 -25
1
27
53
79
105
0.7 -25
1
27
53
79
105
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 11. 82% Duty Cycle Selection Input Voltage Threshold vs. Junction Temperature
IOH, GATE DRIVE SOURCE CURRENT (mA)
Figure 12. Output Sink Resistance vs. Junction Temperature
IOL, GATE DRIVE SINK CURRENT (mA)
350 300 250 200 150 100 50 -25 VDRV = 8V VCC = 15 V 80 ms Pulsed Load 120 Hz Rate
400 350 300 250 200 150 100 50 -25 VDRV = 1V VCC = 15 V 80 ms Pulsed Load 120 Hz Rate
VDRV = 5V
VDRV = 5V
1
27
53
79
105
1
27
53
79
105
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 13. Gate Drive Source Capability vs. Junction Temperature
Figure 14. Gate Drive Sink Capability vs. Junction Temperature
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NCP1212
Tf, GATE DRIVE VOLTAGE FALL TIME (ns) Tr, GATE DRIVE VOLTAGE RISE TIME (ns) 50 50
40
40
30
30
20
20
10
10
0 -25
1
27
53
79
105
0 -25
1
27
53
79
105
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 15. Gate Drive Voltage Rise Time vs. Junction Temperature
1.4 1.3 1.2 1.1 1.0 0.9 0.8 -25 IBOK, BROWNOUT HYSTERESIS CURRENT (mA) VBOK, BROWNOUT INPUT THRESHOLD VOLTAGE (V) 55 50 45 40 35 30 25 -25
Figure 16. Gate Drive Voltage Fall Time vs. Junction Temperature
1
27
53
79
105
1
27
53
79
105
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 17. Brownout Input Threshold Voltage vs. Junction Temperature
Figure 18. Brownout Hysteresis Current vs. Junction Temperature
DMAX48, MAXIMUM DUTY CYCLE (%)
2.1V VDMAX 2.8V
DMAX82, MAXIMUM DUTY CYCLE (%)
60 55 50 45 40 35 30 25 20 -25 1 27
100 VDMAX 3V 90
80
70
60
53
79
105
50 -25
1
27
53
79
105
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 19. Maximum Duty Cycle, DMAX48 vs. Junction Temperature
Figure 20. Maximum Duty Cycle, DMAX82 vs. Junction Temperature
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NCP1212
VCCUVLO, VCC UNDER VOLTAGE LOCKOUT THRESHOLD (V) VCCOVLO, VCC OVERVOLTAGE LOCKOUT THRESHOLD (V) 12 11 30
27
10 9 8 7 6 -25
24
21
18
1
27
53
79
105
15 -25
1
27
53
79
105
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 21. VCC Under Voltage Lockout Threshold vs. Junction Temperature
20 VCCTH, VCC Startup THRESHOLD VOLTAGE (V) IC1, POWER SUPPLY CURRENT BEFORE STARTUP (mA) 200
Figure 22. VCC Overvoltage Lockout Threshold vs. Junction Temperature
VCC = 12V 150
17
14
100
11
8
50
5 -25
1
27
53
79
105
0 -25
1
27
53
79
105
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 23. VCC Startup Threshold Voltage vs. Junction Temperature
IC2, POWER SUPPLY OPERATING CURRENT (mA) IC3, POWER SUPPLY SHUTDOWN CURRENT (mA)
Figure 24. Power Supply Current Startup vs. Junction Temperature
5.0
4.0 3.5 3.0 2.5 2.0 1.5 1.0 -25 VCC = 15V
4.0 VCC = 16V 3.0
2.0
1.0
0.0 -25
1
27
53
79
105
1
27
53
79
105
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 25. Power Supply Operating Current vs. Junction Temperature
Figure 26. Power Supply Shutdown Current vs. Junction Temperature
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NCP1212
Figure 27. Rise Time of Gate Drive Waveform (CL = 1 nF)
4 IC2, SUPPLY CURRENT (mA) IC2, SUPPLY CURRENT (mA) 3.5 3 2.5 2 1.5 1 0.5 0 -0.5 0 5 10 15 20 25 VCC, SUPPLY VOLTAGE (V) Ramp up to 24 V Ramp down from 24 V 4 3.5 3 2.5 2 1.5 1 0.5 0 -0.5 0
Figure 28. Fall Time of Gate Drive Waveform (CL = 1 nF)
Ramp up to 24 V Ramp down from 24 V
5
10
15
20
25
VCC, SUPPLY VOLTAGE (V)
Figure 29. Supply Current vs. Supply Voltage (Duty Cycle = 82% and Output Load = 1 nF)
Figure 30. Supply Current vs. Supply Voltage (Duty Cycle = 48% and Output Load = 1 nF)
300 SWITCHING FREQUENCY (kHz) 250 200 150 100 50 0 400 48% DUTY -CYCLE 82% DUTY CYCLE
600
800
1000
1200
CT, PIN CAPACITANCE (pF)
Figure 31. Switch Frequency vs. CT Pin Capacitance
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NCP1212
DETAILED OPERATING DESCRIPTIONS INTRODUCTION The NCP1212 implements a standard current mode architecture where the switch-off time is dictated by the peak current setpoint. This device represents an ideal candidate where low external part-count is the key system requirement. Additionally, the device provides extensive value-added functions, Soft-Start, Brownout Detect, etc., that can be applied to low-cost AC-DC adaptor applications. The NCP1212 incorporates all the necessary functions normally needed in UC384X based power supply systems: Oscillator section, PWM Latch section, Current Sense section, Brownout Detect protection, Soft-Start and Maximum Duty Cycle Selection. With all those functions, this device becomes a good alternative to UC384X that can help to improve both performance and system cost. Also, the innovative Maximum Duty Cycle Selection feature allows the device applied to both forward and fly-back mode configurations. Detailed functions of individual internal blocks are described in below and a simplified functional block diagram is shown in Figure 2.
Oscillator Section
switching frequency can be selected by choosing proper value of timing capacitor, CT. The CT pin waveform is shown in Figure 32.
3.8 V 82% 2.5 V 48% 48% 1.0 V
Figure 32. CT Pin Waveform for Oscillator PWM Latch Section
The oscillator frequency is programmed by the capacitor connected to CT pin. The capacitor is charged by a constant current source to 3.8 V and 2.5 V for 82% and 48% maximum Duty Cycle condition respectively. Once the selected voltage is reached, CT is then discharged by another constant current source down to 1.0 V and this charging and discharging action will carry on perpetually. Desirable
NCP1212 works in current mode. The power switch current is converted to a positive voltage by inserting a sensing resistor Rsense between the power switch source and the ground. The power switch peak current is compared with the level shifted control input voltage on a cycle-by-cycle basis. Figure 27 illustrated the internal blocks of the function. The PWM latch is initialized by the Oscillator set signal and is terminated by the current sense comparator when the current exceeds the value dictated by the control input or current limit level. The current sense Comparator Latch configuration used ensures that only a single pulse appears at the output during any given oscillator cycle.
+5 V 9K 1 2 3 R 300 ns LEB - + + - 1V Reset Oscillator Set Current Limit S F/F Q 4 FB R 3R -
Output
PWM Control
+ Totem Pole Driver Q DRV
CS Rsense
Output
Figure 33. PWM Latch Function
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NCP1212
Current Sense Section
The current sense pin, CS detects the voltage drop across a current sensing resistor, Rsense connected in between the power MOSFET and Ground. In most cases, a narrow spike on the leading edge of the current waveform can be observed and may cause the power supply to exhibit an instability when the output is lightly loaded. The spike is due to the power transformer inter-winding capacitance and output rectifier recovery time which are unavoidable. NCP1212 provides a 300 ns Leading Edge Blanking block to shield off the spike. With the Leading Edge Blanking function, the CS pin is not sensitive to the power switch turn-on noise and spikes, practically in most applications, no filtering network is required. In normal operation, voltage developed at the current sense input is compared with the level shifted control input voltage and an internal Current Limit Threshold, VCS. In case the CS input exceeds the Current Limit Threshold, which is 1.0 V (typ.) in NCP1212, the gate driver output will be forced to turn off immediately.
Thus the maximum allowable peak current is given by the following equation:
Ipk(max) + 1V Rsense
Soft-Start and Maximum Duty Selection
NCP1212 includes an internal Soft-Start function to simplify designer's job hence make this device easy to use. During the startup phase, a constant current source of 8.0 mA flows out of the SS/DMAX pin once VCC attains the minimum startup voltage. The capacitor connected at SS/DMAX pin is slowly charged up and the voltage developed plus one diode drop, VSST is compared with the saw-tooth waveform, CT from the internal oscillator as shown in Figure 34. Whenever CT voltage is higher than VSST, gate driver output will be turned off. Since VSST rises slowly and it controls the output duty gradually increases as shown in Figure 35. The minimum CT voltage is at 1.0 V, hence there is no output before SS/DMAX pin attains about 0.4 V (1.0 V-1 diode drop). Soft-Start block will have no effect to the PWM operation once VSST reaches 3.2 V.
NCP1212
+5 V
F/F Overload Enable Q S Q 3.2 V Reset - + + - Vsst
8 mA SS/DMAX
Shutdown
CSS
From CT
Duty Cycle Control
Figure 34. Soft-Start Operation
CT
VSST
VDRV
Figure 35. Output Pulse Duty Cycle Depends on the SS/DMAX Pin Voltage
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NCP1212
SS/DMAX pin is also used for the selection of maximum turn on Duty Cycle. The oscillator circuit is designed to operate in either 82% or 48% charging time that corresponds to either 82% or 48% maximum PWM turn on Duty Cycle. As discussed in the Oscillator Section, saw-tooth waveform at CT pin is different for 82% and 48% maximum turn on Duty Cycle and it is shown in Figure 32. The final voltage at SS/DMAX pin determines the maximum turn on Duty Cycle. If 82% maximum turn on duty is desired, simply connect a capacitor from SS/DMAX pin to ground as shown in Figure 36 and the final voltage on the capacitor will be 5.0 V minus one diode drop (X4.3 V).
5.0 V
Overload Detection
ISS = 0.8 mA SS/DMAX
Final Voltage [ 4.3 V
82% Max. Duty Cycle
CSS
Figure 36. 82% Maximum Duty Cycle Selection
For 48% maximum Duty Cycle selection, we need to adjust the final voltage at SS/DMAX to lower than 3.2 V minus one diode drop (X2.5 V). This can be achieved by connecting a resistor in parallel with CSS as shown in Figure 37. The value of this parallel resistor is given by the equation in below:
Rduty + 2.5 V 8 mA
5.0 V Final Voltage = 2.5 V
During output overload or short circuit condition, the PWM controller will pump as much energy as possible to the secondary side and the power only limited by the cycle-by-cycle current limit setting. Components in the power supply circuit such as the power MOSFET and output rectifier may be damaged by this continuous stress. Theoretically, fly-back converter has inherent short circuit protection provided that the PWM controller is supplied by a fly-back auxiliary winding and it has UVLO function. Unluckily, it is quite common that the supply will experience very high leaky voltage spike that prevents the VCC voltage to fall below UVLO level during short circuit. NCP1212 is equipped with an integrated overload detection mechanism, which is irrespective of auxiliary winding voltage level. Overload shutdown is no longer bothered by leakage spike hence a reliable overload protection system can be easily constructed by NCP1212 for both forward and fly-back configuration. Overload detection block is shown in Figure 38. Overload condition is signified by current sense voltage hitting the maximum allowable voltage, 1.0 V. To avoid false trigger that may happen during transient load changes, CSS starts to discharge by 20 mA (ISD-ISS). If overload condition persists, VSST voltage level drops to 0.5 V and triggers the overload shutdown. Overload shutdown is only enabled after the soft-start period. Due to the overload detection mechanism, it is mandatory to connect a capacitor at the SS/DMAX pin. Otherwise overload shutdown may be triggered during startup phase.
ISS = 8 mA
SS/DMAX CSS Rduty
48% Max. Duty Cycle
Figure 37. 48% Maximum Duty Cycle Connection
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NCP1212
+5 V 8 mA
+
-
SS/DMAX
- + From Current Sense + 1V - D CLK Current Limit - + S Q D CLK Q 28 mA
+ -
Overload
Shutdown
+ 0.5 V -
CT
OSC Clock
DMAX
Max. Duty Cycle 48% or 82% + 3.2 V -
+ -
Q S Q
Overload Enable
Reset
- +
Figure 38. Overload Detection Block Diagram
Brownout Protection
NCP1212 has a built-in comparator for brownout detection as shown in Figure 39. Positive terminal of the comparator is connected to a +1.21 V bandgap reference. The IC is prohibited from switching until Brownout Detect pin exceeds 1.21 V. Once the brownout detect threshold is exceeded, 45 mA flows out of the pin and the voltage at this pin is further pushed up to provide hysteresis effect. The Brownout voltage setting is determined by the potential
divider formed with RUpper and RLower. Equations to calculate the resistors are shown below:
RUpper ) RLower + RLower + (VBulk_H * VBulk_L) 45 mA
[1.21 V(VBulk_H * VBulk_L)] (45 mA VBulk_H)
Where VBulk_H and VBulk_L are the desired upper and lower bulk capacitor voltage for brownout detection.
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NCP1212
To Bulk Capacitor
+5 V
45 mA RUpper SW2
+
-
BOK
-
Output
+ RLower + 1.21 V -
Brownout Shutdown
Figure 39. Brownout Detect Block Diagram
Internal 5.0 V Regulator
Overvoltage Protection and Under Voltage Lockout
A low current 5.0 V regulator is available internally for the device operation and reference voltages generation. This voltage not accessible externally and is designed to operate with no external bypass capacitor.
Totem Pole Output Driver
NCP1212 contains a single totem pole output stage that was specifically designed for direct drive of power MOSFETs. It is capable of up to 300 mA peak drive current and has a typical rise time and fall time of 25 ns with 1.0 nF load.
NCP1212 starts operation once VCC reaches 15 V. Overvoltage Protection (OVP) will be triggered if VCC exceeds 25 V and on the other hand, Under Voltage Lockout (UVLO) will take place if VCC drops below 10 V. NCP1212 continues to draw 3.0 mA typical after overload or overvoltage shutdown is triggered. If the startup resistance connected to VCC pin is large enough such that VCC voltage keeps on dropping after shutdown, NCP1212 will restart once VCC drops below UVLO threshold. If the fault condition persists, NCP1212 will enter hi-cup operation. In case system latchoff is required in fault conditions, a smaller startup resistance can be used to sustain the device operation. NCP1212 will remain in shutdown mode as long as VCC is maintained above UVLO threshold after fault is detected.
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NCP1212
APPLICATION INFORMATION AND TYPICAL WAVEFORMS The NCP1212 is an ideal choice for next generation isolated fix switching frequency forward mode converters that only need few external components to complete the system. Converting your existing application from using UC384X controllers to NCP1212 is easy and simple. In below is a description on how to determine external components value for a typical application example. For the schematic of the application, please refer to Figure 1 in this data sheet. Finding the external component values can be broken down into several steps as introduced below: 1. Select the maximum Duty Cycle for forward mode operation and calculate the Soft-Start time. Select the system, operate in forward mode with 82% maximum Duty Cycle. Only a capacitor is required at SS/DMAX pin and the Soft-Start time is determined by the capacitor, CSS. Its value is given by the equation below:
I TSS CSS + V1 * V2
V1 is the Upper Threshold Voltage in the oscillator block and which is effectively controlling the PWM maximum Duty Cycle at gate driver output. Soft-Start block will have no effect to the PWM operation once SS/DMAX pin voltage reaches this threshold. This threshold voltage is 2.5 V with 48% maximum Duty Cycle; V2 is about 0.4 V (1.0 V minus one diode drop) which is the Lower Voltage Threshold for the PWM operation. There will be no PWM gate driver output before SS/DMAX pin voltage attains this threshold. For example, the required Soft-Start time is 50 ms, the timing capacitor, CSS can be calculated as:
8 mA 50 ms CSS + + 0.182 mF 2.5 V * 0.4 V
where: I is an 8.0 mA constant current source flow out of the SS/DMAX pin; TSS is the required Soft-Start time;
115.2 ms
In this case, a 0.22 mF capacitor is used for this application and the Soft-Start time is calculated as 57.75 ms. The charging waveform at SS/DMAX pin is shown in Figure 40. From the captured waveform, the charge time from 0 V to 4.0 V is 115.2 ms and for the voltage charging up to 2.5 V, i.e. hitting the Upper Threshold Voltage, the elapsed time is about 70 ms that matched with the theoretical calculation closely.
4.0 V
Figure 40. SS/DMAX Pin Charging Waveform
Overload condition is signified by current sense input voltage hitting the Maximum Current Sense Threshold, VCS. To avoid false trigger that may happen during transient load change, CSS starts to discharge by an internal current source of 20 mA, ISD-ISS and the overload protection will only be issued until the voltage at SS/DMAX pin falls below 0.5 V. The discharging time, TDIS for 0.22 mF Soft-Start capacitor is given by:
TDIS + CSS (Vref * VD * VOL) ISD * ISS
where: CSS is the Soft-Start timing capacitor; Vref is the internal reference voltage, 5.0 V typical; VD is the internal diode forward voltage on between the reference voltage and SS/DMAX pin in IC internal, is 0.6 V typical; VOL is the overload threshold voltage. Refer to Figure 39 Overload Detection Block Diagram, the overload threshold voltage is 0.5 V typical;
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NCP1212
ISD-ISS is the internal current source for CSS discharging, 20 mA typical. The discharging time for 0.22 mF Soft-Start capacitor is:
TDIS + 0.22 mF (5.0 V * 0.6 V * 0.5 V) + 42.9 ms 20 mA
36 ms
The discharging waveform on SS/DMAX pin is shown in Figure 41. The discharging time from 4.0 V to 0.6 V is measured as 36 ms from Figure 41. By interpolation, discharging time can be estimated as about 41.3 ms when output is overload which agreed with the calculated result.
3.4 V
Figure 41. SS/DMAX Pin Discharging Waveform
2. Determine the PWM Switching Frequency The switching waveform is generated by the action of charging and discharging by internal current sources to a capacitor connected at CT, pin 4. The relationship of the switching frequency and the value of CT is governed by the equation below:
FSW + Ichg D CT (Vth * 1)
3. Determine the BOK Thresholds Brownout detect thresholds are determined by a resistors network that monitors part of the bulk capacitor voltage at BOK pin. Equations below illustrate the calculation of the resistors value for the network.
RUpper ) RLower + RLower + (VBulk_H * VBulk_L) 45 mA
where: Ichg is the charging current to CT, 278 mA typical; D is the selected Maximum Duty Cycle, 48% or 82%; CT is the capacitor connected to CT pin; Vth is the threshold voltage for different Maximum Duty Cycle selection, 2.5 V for 48% Maximum Duty Cycle and 3.8 V for 82% Maximum Duty Cycle. The Switching Frequency against CT is shown in Figure 31 to help the designers to determine the capacitance for their selected switching frequency.
[1.21 V(VBulk_H * VBulk_L)] (45 mA VBulk_H)
Where VBulk_H and VBulk_L are the desired upper and lower bulk capacitor voltage for brownout detection. Assume VBulk_H = 212 Vdc and VBulk_L = 186 Vdc, select 3.3 kW for RLower then RUpper can be calculated to be 576 kW.
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NCP1212
Channel 1: The MOSFET's VDS Switching Waveform Channel 2: Primary Bulk Capacitor Voltage Channel 3: BOK Pin Voltage
Figure 42. Brownout Detect Waveforms
Experimental results for the Brownout action were shown in Figure 42. From the captured waveforms, it can be noted that the Brownout Input Threshold Voltage is 1.21 V and Brownout Hysteresis Voltage is 1.36 V at BOK pin. 4. Improving Light Load and No Load Regulation for High Power Applications For high power applications, limited by the dynamic range of the control circuitry, i.e. the control feedback is limited by the swing of the optocoupler. When VFB reaches about 0.1 V at light load conditions, it no longer has the means to further reduce that voltage because of the saturation of the optocoupler. At light load or no load conditions, the primary current is very small and as the current
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sensing resistor is also small for high power applications, the current sense feedback voltage will be much smaller than 0.1 V. Consequently, the control will force to acquire maximum Duty Cycle operation and the output will increase without control. In order to improve the poor regulation at light load, a small circuit is added as shown in Figure 43. With the additional circuitry, when VFB falls below 0.1 V, Q2 will drive additional offset current to CS pin and modify the current sensing voltage, VCS. For VFB higher than 0.1 V at normal load operation, Q2 will be turned off due to limited Vbe.
NCP1212
VCC R8 2.5 K
Q1 PNP
+5 V 9K 1 2 3 4 R2 100 FB R Q2 PNP 3K CS 0.1 + - 1V Reset OSC Block Set S Q Totem Pole Driver 300 ns LEB Current Limit 2 3 4 3R -
Output
+
- +
Output
1 F/F R Q Output
Figure 43. Suggested Solution for Better Light Load Regulation
The skip mode operation waveform at light load is shown in Figure 44. Where Channel 1 is the gate drive pin waveform and Channel 2 is the CS input pin waveform.
Figure 44. Skip Mode Switching Waveform at Light Load
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NCP1212
PACKAGE DIMENSIONS
SOIC-8 D SUFFIX CASE 751-07 ISSUE AG
-X- A
8 5
B
1 4
S
0.25 (0.010)
M
Y
M
-Y- G C -Z- H D 0.25 (0.010)
M SEATING PLANE
K
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
DIM A B C D G H J K M N S
SOLDERING FOOTPRINT*
1.52 0.060
7.0 0.275
4.0 0.155
0.6 0.024
1.270 0.050
SCALE 6:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NCP1212
PACKAGE DIMENSIONS
PDIP-8 N SUFFIX CASE 626-05 ISSUE L
8
5
-B-
1 4
NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. DIM A B C D F G H J K L M N MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC --- 10 _ 0.76 1.01 INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC --- 10_ 0.030 0.040
F
NOTE 2
-A- L
C -T-
SEATING PLANE
J N D K
M
M TA
M
H
G 0.13 (0.005) B
M
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NCP1212
The product described herein (NCP1212), may be covered by one or more of the following U.S. patents: 6,385,060, 6,385,061, and 6,271,735. There may be other patents pending.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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NCP1212/D


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